ENZOTECH MST-DFI-DK heatsink was designed to
offer
exceptional heat dissipation for integrated MOSFET motherboards
cards. MST-DFI-DK heatsink is made using a forged copper process
which produces a
dense material that is extremely efficient at heat extraction.
The MST-DFI-DK heatsink is far superior to traditional heat sinks
currently
found on the market and it provides the best thermal conductivity
available to dissipate heat from the MOSFET in your system.
|
Dimensions (mm)
|
63.5(L) x
16(W) x29.6(H) |
|
Material
|
C1100 Forged Copper |
|
Weight
|
50g |
|
Thermal Adhesive
|
Fujipoly GR-d Thermal Tape |
|
SUPPORTED
MB
|
|
|
DFI
|
- DFI LANParty DK X48-T2RS
- DFI LANParty DK X38-T2R
- DFI LANparty DK P35-T2RS
- DFI LANparty DK P45-T2RS
- DFI LANparty DK P45-T3RS |
