ENZOTECH MST-DFI-DK heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards. MST-DFI-DK heatsink is made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MST-DFI-DK heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.





Dimensions (mm)
63.5(L) x 16(W) x29.6(H)
Material
C1100 Forged Copper
Weight
50g
Thermal Adhesive
Fujipoly GR-d Thermal Tape
SUPPORTED MB

DFI
- DFI LANParty DK X48-T2RS
- DFI LANParty DK X38-T2R
- DFI LANparty DK P35-T2RS
- DFI LANparty DK P45-T2RS
- DFI LANparty DK P45-T3RS




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