ENZOTECH MST-73 heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards.
MST-73 heatsink is made by using a forged copper process which produces a
dense material that is extremely efficient at heat extraction. The
MST-73 heatsink is far superior compared to traditional heat sinks currently
found in the market.It provides the best thermal conductivity
available to dissipate heat from the MOSFET in your system.
|
Dimensions (mm)
|
79.5(L) x
14(W) x 29.6(H) |
|
Material
|
C1100 Forged Copper |
|
Weight
|
62g |
|
Thermal
Adhesive
|
Fujipoly GR-d Thermal Tape |
|
SUPPORTED
MB
|
|
|
ASUS
|
P6T6 WS Revolution、P6T WS
Professional、P6T Deluxe、P6T Deluxe/OC Palm
|
