ENZOTECH MST-66 heatsink was designed to
offer
exceptional heat dissipation for integrated MOSFET motherboards cards.
MST-66 heatsink is made using a forged copper process which produces a
dense material that is extremely efficient at heat extraction. The
MST-66 heatsink is far superior to traditional heat sinks currently
found on the market and it provides the best thermal conductivity
available to dissipate heat from the MOSFET in your system..
|
Dimensions (mm)
|
72(L) x
13(W) x 29.6(H) |
|
Material
|
C1100 Forged Copper |
|
Weight
|
55g |
|
Thermal
Adhesive
|
Fujipoly GR-d Thermal Tape |
|
SUPPORTED
MB
|
|
GigaByte
|
EX58-UD5,EX58-UD4P,EX58-Extreme,GA-P35-DS3P,GA-P35-DS4,GA-P35-DQ6,GA-EP45-DS3P,GA-EP45-DS4,GA-EP45-DS5,GA-EP45-DQ6,GA-EP45-Extreme,GA-EP45T-Extreme |
