ENZOTECH MOS-C1 heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1 heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1 heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.

  • Compatible with all the Motherboards
  • Pure forged copper
  • Easy installation by using 3M™ 8815 Thermal Tape
  • Multipack - Ten (10) piece set




Dimensions (mm)
6.5(L) mm x6.5mm(W) x12mm(H)
Material
C1100 Forged Copper
Weight
2g (Each)
Thermal Adhesive
3M™ 8815 Thermal Tape (Datasheet)




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