AS-MSFIII-MOS is formed in one piece. Using seamless welding technique, it allows the product to be smaller and provides better thermal performance compared to other water cooled products in the market.
Dimensions (mm) |
109.5(L) x108.8(W) x20.2(H) |
Weight |
179g |
Material |
C1100 Copper |
SUPPORTED MB |
|
ASUS |
-Maximus III Formula |
